发明名称 |
THICKNESS DISTRIBUTION CONTROL FOR ELECTROPLATING |
摘要 |
<p>The invention is directed to an assembly for electroplating comprising an electroplating bath and non-conductive plates. The invention is also directed to an assembly for electroplating comprising an electroplating bath, elements with electrically adjustable resistance, and ampere-hour meters. The invention is further directed to methods for monitoring, controlling and adjusting the thickness distribution of an electroplated material on an object. The object can be of any shape as long as it can electrically charged.</p> |
申请公布号 |
WO2007082275(A2) |
申请公布日期 |
2007.07.19 |
申请号 |
WO2007US60408 |
申请日期 |
2007.01.11 |
申请人 |
SIPIX IMAGING, INC.;KANG, GARY;CHAUG, YI-SHUNG |
发明人 |
KANG, GARY;CHAUG, YI-SHUNG |
分类号 |
C25B9/00;C25D21/12 |
主分类号 |
C25B9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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