SUBSTRATE INCORPORATING COMPONENT AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a substrate incorporating a component with the high resin connection reliability by securely filling a resin flow embedding part 108a with resin. SOLUTION: The substrate incorporating component is provided with electronic components loaded on the upper face of a circuit board 101 and a component incorporating layer 108 which covers the electronic components and is arranged on an electronic component loading face-side of the circuit board 101. The circuit board 101 and the component incorporating layer 108 are integrated. The component incorporating layer 108 is provided with a resin flow embedding part 108a formed in a position corresponding to the electronic components so that it covers the electronic components and a resin pressurization flow-out part 146 installed to surround the resin flow embedding part 108a. The resin flow embedding part 108a is filled with the same resin as the resin pressurization flow-out part 146. Since large pressure can be added to the resin pressurization flow-out part 146, resin easily flows out of the resin pressurization flow-out part 146 to the resin flow embedding part 108a. COPYRIGHT: (C)2007,JPO&INPIT