| 摘要 |
PROBLEM TO BE SOLVED: To provide a liquid phenol resin or a composition for an excellent epoxy resin curing agent endurable to a moisture-proof reliability test and having fluidity suitable for underfilling and potting operations, even in a non-solvent state, so as to be usable in electric/electronic industries. SOLUTION: A liquid phenol compound expressed by formula (1) (R<SP>1</SP>'s are each H, methyl or ethyl, and may be identical to or different from each other with respect to their kinds and positions of right and left rings on which R<SP>1</SP>'s are placed) is used as the curing agent for the epoxy resin. It is preferred to use an allylated 2,2'-bisphenol as the liquid phenol compound. Through the use of this liquid epoxy curing agent, the curing agent for a low viscosity epoxy resin composition suitable for liquid sealant applications in the electronic/electric industries is obtained. COPYRIGHT: (C)2005,JPO&NCIPI
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