发明名称 FORMING METHOD OF PROTECTION MEMBRANE COVERING ELECTRONIC PART AND ELECTRONIC PART HAVING PROTECTION MEMBRANE
摘要 <P>PROBLEM TO BE SOLVED: To provide a forming method of a protection membrane in which, for example, an organic EL element mounted on one face of the substrate can be effectively sealed. <P>SOLUTION: Crucibles 15a-15c as an evaporation source are arranged opposed to the organic EL element 2 mounted on one face of the transparent substrate 1. Further, a mask 11 having an opening 11a corresponding to the organic EL element 2 is prepared, and this mask 11 is arranged between the substrate and the crucibles 15. The position of the mask 11 to the substrate 1 is increased step by step and the material to be evaporated from the crucibles 15a-15c is chosen. Thereby, a first layer protection membrane 21 covering the EL element 2 and a second layer protection membrane 22 covering more widely the first protection membrane on it are formed, and further, a third layer or more of the protection membranes can be formed in the same manner. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004095330(A) 申请公布日期 2004.03.25
申请号 JP20020254613 申请日期 2002.08.30
申请人 TOHOKU PIONEER CORP 发明人 OHATA HIROSHI;OGOSHI KUNIZO;KIMURA MASAMI
分类号 H05B33/04;C23C14/06;C23C14/24;H01L51/50;H01L51/52;H01L51/56;H05B33/10 主分类号 H05B33/04
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