发明名称 Semiconductor device and method for fabricating the same
摘要 A novel and very useful method for forming a crystal silicon film by introducing a metal element which promotes crystallization of silicon to an amorphous silicon film and for eliminating or reducing the metal element existing within the crystal silicon film thus obtained is provided. The method for fabricating a semiconductor device comprises steps of intentionally introducing the metal element which promotes crystallization of silicon to the amorphous silicon film and crystallizing the amorphous silicon film by a first heat treatment to obtain the crystal silicon film; eliminating or reducing the metal element existing within the crystal silicon film by implementing a second heat treatment within an oxidizing atmosphere; eliminating a thermal oxide film formed in the previous step; and forming another thermal oxide film on the surface of the region from which the thermal oxide film has been eliminated by implementing another thermal oxidation.
申请公布号 US6528358(B1) 申请公布日期 2003.03.04
申请号 US20000536792 申请日期 2000.03.28
申请人 SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 YAMAZAKI SHUNPEI;TERAMOTO SATOSHI;KOYAMA JUN;OGATA YASUSHI;HAYAKAWA MASAHIKO;OSAME MITSUAKI;OHTANI HISASHI;HAMATANI TOSHIJI
分类号 H01L21/02;H01L21/20;H01L21/28;H01L21/322;H01L21/324;H01L21/336;H01L21/77;H01L21/84;H01L27/12;H01L29/49;H01L29/786;(IPC1-7):H01L21/00;H01L21/44 主分类号 H01L21/02
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