| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus wherein the defect of a metal part such as an electrode or the like in an electronic component is detected automatically by a visual inspection. SOLUTION: In the visual inspection of a chip-type electronic component by the visual inspection apparatus, an imaging part 13 first images an electrode part in an object work conveyed by a mounting base, and image data is transmitted to a control part. Then, an area calculation part 15B counts pixels at a reference luminance or less with reference to the image data stored in an image storage part 15A so as to calculate the occupation rate of a low-luminance region. Then, a defect judgment part 15C judges whether the occupation rate exceeds a reference occupation rate or not. When the occupation rate is the reference occupation rate or more, it is judged that the defect exists in the electrode part in the object work. The reference luminance, the reference occupation rate and the illumination angle of light shone at the object work in an imaging operation by the imaging part 13 are set in advance on the basis of an experiment according to the object work and the defect to be detected. Therefore, the visual inspection of an external electrode in the chip-type electronic component can be performed automatically by an image processing operation. |
