发明名称 APPARATUS FOR ADHERING COVER LAY FOR MANUFACTURING SEMICONDUCTOR
摘要 PURPOSE: An apparatus for adhering a cover lay is provided to automatically adhere a cover layer on upper and lower surfaces of a lead frame, by adhering the cover layer on an upper surface of the lead frame transferred by a transfer block by using an elevating block, and by pressuring and adhering the cover layer with a pressuring roller. CONSTITUTION: A transfer block(22) is horizontally mounted on a bed(20) to be capable of being transferred, horizontally transferring a lead frame(4) disposed on the transfer block. A transfer unit(46,48) transfers the transfer block. A supporting unit(26) is installed at an upper portion of a transfer path of the transfer block. A cover lay roll(28) is hinge-coupled to the supporting unit while a cover layer of a tape shape is wound around the outer surface of the cover layer roll. An absorbing unit is installed at a lower portion of the cover lay roll to absorb the cover layer untied from the cover layer roll. An elevating unit(30) is mounted at the supporting unit to be capable of elevating, and temporarily adheres the cover layer to an upper surface of the lead frame passing under the cover layer as the elevating unit elevates. A pressuring role(32) is mounted at a rear part of the elevating unit, and closely pressures the temporarily adhered cover layer to the lead frame. A cutting units(64,66) are mounted between the elevating unit and the pressuring role to cut the cover layer by a predetermined length.
申请公布号 KR20010016375(A) 申请公布日期 2001.03.05
申请号 KR20000073844 申请日期 2000.12.06
申请人 SUN YANG TECH CO., LTD. 发明人 SUN, HYO DEUK
分类号 H01L21/50;(IPC1-7):H01L21/50 主分类号 H01L21/50
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