The smart card has a main body (4) that has a planar antenna embedded into the base. A contact spring (9) is set into a hole in the carrier and this is contacted by a module (1) that has the integrated circuit chip (7) on the surface that is set into a cavity. This is embedded into a suitable resin. An Independent claim is included for a method for manufacturing of electrical connection of module comprising electronic components, inserted in cavity of card body of chip card.
申请公布号
DE19749650(A1)
申请公布日期
1999.05.12
申请号
DE19971049650
申请日期
1997.11.10
申请人
MEINEN, ZIEGEL & CO. GMBH, 85635 HOEHENKIRCHEN-SIEGERTSBRUNN, DE