发明名称 SEMICONDUCTOR DEVICE AND PART THEREOF
摘要 PROBLEM TO BE SOLVED: To prevent a molten brazing filler metal from flowing out on the disc surface more than required by forming a first metal layer entirely on the opposite sides of an insulating board, forming a nickel layer thereon and forming an insular metal island further thereon. SOLUTION: A molybdenum/manganese layer 5 is formed, by deposition or sputtering, on an insulating disc board 4 made of alumina nitride and a nickel layer 6 is formed on the entire surface thereof by deposition or sputtering. Furthermore, a metal island region 2 comprising a nickel layer 7 and a gold layer 8 is formed thereon by deposition or sputtering using a grid mask. According to the method, flow out of brazing filter metal can be suppressed and a region for bonding a gold wire can be ensured without requiring any special blocking region.
申请公布号 JPH1154659(A) 申请公布日期 1999.02.26
申请号 JP19970203124 申请日期 1997.07.29
申请人 NEC YAMAGATA LTD 发明人 YAJIMA TOMIO
分类号 C04B35/581;H01L23/12;H01L23/14 主分类号 C04B35/581
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