发明名称 FLUID TREATMENT APPARATUS
摘要 <p>A fluid treatment apparatus and method for applying first and second fluids (e.g., etchant and water) to an article (e.g., circuit board) passing through the apparatus at a predetermined rate. The first fluid is impinged on a surface of the article (11) and thereafter collected within the apparatus' common housing (13). The second fluid is impinged onto the surface of the article and collected within the same housing but at a location separate from the collected first fluid so as to at least partially prevent mixing thereof. The preferred means for effecting fluid impingement comprises separate fluid injectors, each including at least two rows of fluid jet injectors (27) therein. The collected fluids are each returned to the respective impingement means (23, 41). Replenishment of the second fluid is accomplished using a pump which supplies the second fluid, while the apparatus also includes means (e.g., a drain) to effectively remove the second fluid at a rate similar to the supply rate for the second fluid. The first fluid is also maintained at an established level above the article's surface using suitable means (e.g., dual rollers) located relative (e.g., on opposite sides of) the first fluid impingement means. Similar level retention for the second fluid is also possible. Cascading of the collected second fluid is also defined, this occuring within the same housing chamber which serves to collect the first fluid. <IMAGE></p>
申请公布号 KR0149205(B1) 申请公布日期 1998.12.15
申请号 KR19940006203 申请日期 1994.03.28
申请人 IBM CORP. 发明人 BARD, STEVEN LINDZ;BENDZ, GERALD A.;CANESTARO, MICHAEL J.;CHAPURA, JOHN R.;FRANKOSKI, EDWARD J.;HORAN, MICHAEL S.;JONES, JEFFREY D.;KAMPERMAN, JAMES S.;KJELGAARD JR., JOHN R.
分类号 B05C5/00;B05B15/04;C23F1/08;H01L23/12;H05K3/00;H05K3/06;H05K3/18;(IPC1-7):H05K3/26 主分类号 B05C5/00
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