THERMOSETTING COMPOSITION CONSISTING OF POLYBUTADIENE OR POLYISOPRENE AND MANUFACTURE OF THE SAME

摘要

PROBLEM TO BE SOLVED: To lower tackiness for realizing automatic laminating process for laminating a foil by including a thermosetting composition consisting of polybutadiene or polyisoprene resin, woven glass fiber cloth and preferably ceramic filler particles at a particular rate to form a printed circuit board. SOLUTION: A printed circuit board 40 is formed, including thermosetting composition of 25 to 50 volume %, woven cloth of 10 to 40 volume % and filler particle of 5 to 60 volume %. The thermosetting composition includes polybutadiene-based or polyisoprene-based resin (or mixture of these) and a polymer containing unsaturated butadiene or polyisoprene cross-linking with this polybutadiene or polyisoprene resin. The woven cloth 42 is composed of an adequate fiber, more preferably, a heat-resistant web formed by weaving glass or heat-resistant polyester fiber. Moreover, suitable filler is rutile (titanium dioxide) and amorphous silica.