发明名称 METAL FOIL-LAMINATED POLYIMIDE FILM
摘要 PURPOSE: To integrally laminate a metal foil and a polyimide substrate layer with high adhesion by laying the metal foil over a multilayer polyimide thin film provided by integrally laminating thermoplastic aromatic polyimide layers of a low logarithmic viscosity on a side of a high temperature-resistant polyimide substrate layer, and then heating and pressurizing the layers. CONSTITUTION: A multilayer polyimide film 2 of a metal foil-laminated polyimide film 1 is formed by coating at least one side of a high temperature-resistant aromatic polyimide substrate layer with a thin film formed by applying thereto a thermoplastic aromatic polyimide thin film by a coating method, and then drying and heating the laminate. The metal foil-laminated polyimide film 1 is formed by laying a metal foil on the thermoplastic aromatic polyimide thin film of the multilayer polyimide film 2 and then heating and pressuring them for lamination.
申请公布号 JPH08230103(A) 申请公布日期 1996.09.10
申请号 JP19950037461 申请日期 1995.02.27
申请人 UBE IND LTD 发明人 INOUE HIROSHI;TAKABAYASHI SEIICHIRO;TANIOKA RIKIO
分类号 B32B15/08;B32B15/088;H05K1/03;(IPC1-7):B32B15/08 主分类号 B32B15/08
代理机构 代理人
主权项
地址