发明名称 |
METAL FOIL-LAMINATED POLYIMIDE FILM |
摘要 |
PURPOSE: To integrally laminate a metal foil and a polyimide substrate layer with high adhesion by laying the metal foil over a multilayer polyimide thin film provided by integrally laminating thermoplastic aromatic polyimide layers of a low logarithmic viscosity on a side of a high temperature-resistant polyimide substrate layer, and then heating and pressurizing the layers. CONSTITUTION: A multilayer polyimide film 2 of a metal foil-laminated polyimide film 1 is formed by coating at least one side of a high temperature-resistant aromatic polyimide substrate layer with a thin film formed by applying thereto a thermoplastic aromatic polyimide thin film by a coating method, and then drying and heating the laminate. The metal foil-laminated polyimide film 1 is formed by laying a metal foil on the thermoplastic aromatic polyimide thin film of the multilayer polyimide film 2 and then heating and pressuring them for lamination. |
申请公布号 |
JPH08230103(A) |
申请公布日期 |
1996.09.10 |
申请号 |
JP19950037461 |
申请日期 |
1995.02.27 |
申请人 |
UBE IND LTD |
发明人 |
INOUE HIROSHI;TAKABAYASHI SEIICHIRO;TANIOKA RIKIO |
分类号 |
B32B15/08;B32B15/088;H05K1/03;(IPC1-7):B32B15/08 |
主分类号 |
B32B15/08 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|