| 摘要 |
PURPOSE: To perform the checking of the damages of a semiconductor element and its insulation sheet and their replacements in a short time, by forming through holes for attaching and detaching its fixing screws in a printed board present in a covering way just above the fixing screws. CONSTITUTION: Each of screws 10 is detached from a base 1 by the inserting of a detaching tool into a through hole 11 formed in a printed board 7. Thereby, a semiconductor element 2 can be detached from the base 1 in an integral state of the printed boards 6, 7 and the presence of its damage and the breakage of its insulation sheet can be checked in a short time. When there is no damage in the semiconductor element 2, both can be assembled as they are. Still, since the through holes 11 are formed in the printed boards 6, 7, the wiring patterns of the printed boards 6, 7 may be altered. However, since the through hole 11 has allowably the same diameter as the small head part of the screw 10, the extent of the alteration of the wiring patterns is made small, and the sizes of the printed boards 6, 7 are never changed largely. |
