首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
Verfahren zur Herstellung von Fluormethyl-substituierten Pyridin-carbodithioaten.
摘要
申请公布号
DE69115090(D1)
申请公布日期
1996.01.18
申请号
DE19916015090
申请日期
1991.03.18
申请人
ROHM AND HAAS CO., PHILADELPHIA, PA., US
发明人
BAYSDON, SHERROL LEE, CHESTERFIELD, MISSOURI 63017, US;PULWER, MITCHELL JOEL, ST. LOUIS, MISSOURI 63146, US
分类号
A01N43/40;C07D211/60;C07D213/83;(IPC1-7):C07D213/83;C07D211/78
主分类号
A01N43/40
代理机构
代理人
主权项
地址
您可能感兴趣的专利
IRRIGIDIMENTI PER PIEGATURA DA APPLICARE A MANUFATTI CON FUNZIONE PORTANTE PER QUALSIASI MODALITA' DI UTILIZZO, ALLO SCOPO DI AUMENTARE LA RESISTENZA E DIMINUIRE IL PESO DELLE STRUTTURE DENOMINATO IRRIGIDENTE.
Process for fabricating a ridge pin junction comprising spaced apart doped regions, application to the fabrication of electro-optical modulators and photodetectors
Semiconductor light emitting device and semiconductor wafer
Compound semiconductor device on virtual substrate
Ultraviolet sensor and method for manufacturing the same
Solid-state imaging device and electronic equipment
Pixel structure and fabricating method thereof
Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof
Nanowire capacitor for bidirectional operation
Substrate processing apparatus, method of manufacturing semiconductor device, and non-transitory computer-readable recording medium
Stress enhanced high voltage device
Electrostatic discharge resistant diodes
High-k dielectrics with gold nano-particles
Method for directly adhering two plates together, including a step of forming a temporary protective nitrogen
Thin-film transistor array substrate and display device including the same
In-situ annealing for extending the lifetime of CMOS products
Semiconductor device
Structure of wafer level chip molded package
Enhanced flip chip structure using copper column interconnect
Semiconductor device and method of fabricating the same
