| 摘要 |
PURPOSE:To suppress the generation of molding voids, and to provide a semiconductor device manufacturing resin molding device with which reliability can be improved. CONSTITUTION:The title resin molding device is provided with a closed type mold pot 13, a rotary pump 23 to be used to decompress the above-mentioned mold pot 13 lower than the atmospheric pressure, an air vent 24 with which the mold pot 13 and the rotary pump 23 are communicated, and a hose 24. |
