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发明名称
PACKAGE SUBSTRATE FOR IC
摘要
申请公布号
JPS6282371(A)
申请公布日期
1987.04.15
申请号
JP19850224287
申请日期
1985.10.08
申请人
MITSUBISHI ELECTRIC CORP
发明人
OKUBO ITARU
分类号
H01L21/66;G01R31/30
主分类号
H01L21/66
代理机构
代理人
主权项
地址
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