| 摘要 |
PURPOSE:To eliminate the disconnection of wires on the titled semiconductor as well as to accomplish the thinning of a package by a method wherein, when a perforated part is provided on an electric circuit wiring substrate and a semiconductor element is going to be filled in the perforated part, the lead part on the substrate and the electrode part on the surface of the electrode are bonded using an Au wire, the element is first filled in by bringing it in a floating state in the air, and subsequently the surface of the connected part of the electrode part and a wire is coated by a humidity resisting insulating material. CONSTITUTION:A perforated part is formed on the electric circuit wiring substrate 1, a semiconductor element 2 is filled in the perforated part, the Al electrode part 3 on the element 2 and the lead part 5 provided on the substrate 1 are connected using a metal wire 4, and the element 2 is left in the state wherein it is floating in the air. Then, the circumference of the electrode part 3, which constitutes the connection terminal part with the wire 4, and the lead part 5 is coated by a humidity resisting insulating material 7, and a part of the substrate 1, the wire 4 and the insulating material 7 are sealed using resin 6, thereby enabling to prevent the generation of corrosion on the electrode part 3 even when moisture is infiltrated from the interface of the above-mentioned materials. |
