发明名称 COMPRESSION BONDING TYPE SEMICONDUCTOR DEVICE
摘要 PURPOSE:To discriminate the surface and back of a thermal buffer electrode member easily, and to simplify assembly by previously making the shape of the member incongruous in the surface and the back when the member is set up between the electrode of a semiconductor element and an electrode body for out the electrode. CONSTITUTION:In a transistor for power, the emitter electrodes 1e and the base electrodes 1b, height thereof differs, are surrounded by an insulating layer 2 and projected. The electrodes 1e are projected to sections higher than the electrodes 1b, and the electrodes 1e are connected to the emitter electrode body 4E through the thermal buffer electrode member 3. In the constitution, the thermal buffer electrode plate 3 is prepared by a blanking die for molding, but burr is often generated at that time. When the burr is formed downward and is in contact with the electrode 1b, an unforeseen accident is generated. Accordingly, a notch section 33b is formed previously while being put aside to a pawl section 33a on the punching side of a press, and the shapes of the surface and the back on viewing from the punched side by the press are made incongruous, thus preventing defective mounting.
申请公布号 JPS5954231(A) 申请公布日期 1984.03.29
申请号 JP19820164064 申请日期 1982.09.22
申请人 TOKYO SHIBAURA DENKI KK 发明人 IWASAKI MASAMI;USUI YASUNORI
分类号 H01L21/52;H01L21/58;(IPC1-7):01L21/58 主分类号 H01L21/52
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