| 摘要 |
<P>PROBLEM TO BE SOLVED: To attain an airtight sealing package ensuring airtightness inside the package for a long time, or a sealing structure reducing breakdown due to pressure from outside, by using a substrate for sealing. <P>SOLUTION: A frame formed of a semiconductor material is provided on a first substrate and joined to a second substrate having a semiconductor element. Thereby the first and second substrates are stuck together so that the semiconductor element is positioned inside the frame. The frame may be formed by combining either two L-shaped semiconductor members or four or more bar-shaped semiconductor members as frame members constituting the frame. <P>COPYRIGHT: (C)2009,JPO&INPIT |
