| 摘要 |
Disclosed is an adhesive resin composition containing (a) a thermosetting resin component such as an epoxy resin, (b) a latent curing agent, (c) a photopolymerizable resin component having an unsaturated group such as an acrylic monomer, and (d) a photopolymerization initiator. This adhesive resin composition is excellent in durability and reliability, and enables to bond two articles (such as components) without causing displacement during assembling of an electronic product, optical product or the like which requires precise alignment. |
