Electroplater and method

摘要

A method for rinsing a substrate held by a substrate holder in an electroplater includes positioning at least a first portion of the substrate holder and an electroplating bath in the electroplater relative to one another such that the substrate and the first portion of the substrate holder are removed from the electroplating bath. A retractable shutter in the electroplater is closed to where the closed retractable shutter is located between the first portion of the substrate holder and the electroplating bath as positioned. The substrate is rinsed with a solution wherein the closed retractable shutter prevents substantially all of the solution from entering into the electroplating bath.