| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce a time required for wire-bonding when a first adherend is connected to a second adherend via a plurality of wires.SOLUTION: A method for manufacturing a semiconductor device 10 having a first adherend 20, a second adherend 120 and a plurality of wires W electrically connected to the first adherend 20 and the second adherend 120, comprises: a first junction step for simultaneously jointing the plurality of wires W and the first adherend 20 by using a bonding tool 12 capable of pressing the plurality of wires W; and a second junction step for simultaneously jointing the plurality of wires W and the second adherend 120 by using the bonding tool 12.</p> |
