| 摘要 |
PROBLEM TO BE SOLVED: To provide chamfering device and method capable of suppressing degradation of processing accuracy due to change in the relative position of a grindstone and the periphery of a wafer incident to temperature rise of a device, in chamfering a wafer.SOLUTION: A chamfering device of wafer including a stage rotatable about a shaft for holding a wafer, and movable in the X-Y-Z direction by a moving shaft, and a grindstone rotatable about the shaft for chamfering the periphery of the wafer held by the stage, is further provided with a first heating element for heating the grindstone and the rotating shaft thereof, a first thermometer for measuring the heating temperature of the first heating element, and a controller performing automatic control of the heating by the first heating element, and the measurement by the first thermometer. |
