| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting an electronic component that prevents the electronic component from being mounted obliquely to a substrate and prevents reduction of soldering strength.SOLUTION: The method is for mounting an electronic component (10) on a substrate (20) by printing a solder (30) on a first solder printing region (26) set on a first pad (22) and second solder printing regions respectively set on a plurality of second pads (24), the method comprising: the electronic component (10) having a central heat radiating electrode (12) and a plurality of signal electrodes (14); and the substrate (20) having the first pad (22) formed corresponding to the central heat radiating electrode (12) and the plurality of second pads (24) formed corresponding to the plurality of signal electrodes (14). The area of the first solder printing region (26) is set so that thickness of the solder (30) melted in the first solder printing region (26) and thickness of the solder (30) melted in the second solder printing region (28) lie within a given range. |
