发明名称 |
Semiconductor Device and Method of Manufacture Thereof |
摘要 |
A semiconductor device, a method of manufacturing a semiconductor device and a method for transmitting a signal are disclosed. In accordance with an embodiment of the present invention, the semiconductor device comprises a first semiconductor chip comprising a first coil, a second semiconductor chip comprising a second coil inductively coupled to the first coil, and an isolating intermediate layer between the first semiconductor chip and the second semiconductor chip. |
申请公布号 |
US2012181874(A1) |
申请公布日期 |
2012.07.19 |
申请号 |
US201113008591 |
申请日期 |
2011.01.18 |
申请人 |
WILLKOFER STEFAN;WAHL UWE;KNOTT BERNHARD;HAMMER MARKUS;STRASSER ANDREAS |
发明人 |
WILLKOFER STEFAN;WAHL UWE;KNOTT BERNHARD;HAMMER MARKUS;STRASSER ANDREAS |
分类号 |
H01F38/14;H01L21/50;H01L23/52 |
主分类号 |
H01F38/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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