| 摘要 |
<p>Provided is an infrared sensor module whereby it is possible to reduce extrusion of the lens-anchoring adhesive and to detect infrared in highly accurate and highly reliable fashion while maintaining a highly accurate aperture diameter. The infrared sensor module includes an infrared sensor element (30) for detecting infrared, and a signal processing circuit element (40) for processing the output of the infrared sensor element (30), the elements being disposed on a substrate (10) and housed in a case (20). The case (20) is furnished with an open window (23) for an optical member. Mounted in the open window (23) is a lens (22) as the optical member situated a predetermined distance from the infrared sensor element (30), and adapted to focus infrared light from the outside onto the infrared sensor element (30). The open window (23) has a thin-walled portion along the rim (23R) of the window on the surface where the lens (22) is mounted, a recessed portion (25) is formed between the rim of the lens (22) and the rim (23R) of the open window (23), and the recessed portion (25) constitutes a filled portion filled with an adhesive (24).</p> |
