| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring structure manufacturing method by which fine wiring formed so as to extend over a plurality of materials is prevented from being disconnected and desirable fine wiring is formed, in the formation of fine wiring using an inkjet system, to provide a wiring structure manufacturing apparatus, and to provide a wiring structure. <P>SOLUTION: A first adhesion auxiliary layer (14) corresponding to the base material of a substrate (10) is pattern-formed by an inkjet system, and a second adhesion auxiliary layer (16) corresponding to a silicon device (12) is pattern-formed by the inkjet system, so as to correspond to a pattern of electrical wiring (20) that is formed on the surface of the substrate (10) containing silicon device (12) so as to extend over the substrate and the silicon device. Then, a plating receptive layer (18) is pattern-formed by using the inkjet system on the first adhesion auxiliary layer and second adhesion auxiliary layer. Further, the electrical wiring (20) is formed by applying a plating treatment to the plating receptive layer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
