发明名称 |
ELECTROLYTIC COPPER COATING AND METHOD OF MANUFACTURE THEREFOR, AND COPPER ELECTROLYTE FOR MANUFACTURING ELECTROLYTIC COPPER COATINGS |
摘要 |
An object of the present invention is to provide an electrolytic copper coating that exhibits a bendability and flexibility equal to or better than those of rolled copper foil after the heat history in a circuit board fabrication process, especially after a heat history equivalent to the heat history applied when bonding with a polyimide film. The present invention provides an electrolytic copper coating and a method of manufacturing the same wherein, when performing heat treatment so that the LMP value shown in Equation 1 becomes 9000 or more, the result becomes a crystal distribution of crystal grains, having a maximum length of crystal grains after heat treatment of 10 µm or more, of 70% or more: LMP = T + 273 * 20 + Logt
where, 20 is a material constant of copper, T is temperature (°C), and t is time (hr).
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申请公布号 |
EP2302103(A1) |
申请公布日期 |
2011.03.30 |
申请号 |
EP20090762554 |
申请日期 |
2009.06.12 |
申请人 |
THE FURUKAWA ELECTRIC CO., LTD.;ISHIHARA CHEMICAL CO., LTD. |
发明人 |
SAITO, TAKAHIRO;SUZUKI, YUJI;IUCHI, SHOYA;NISHIKAWA, TETSUJI |
分类号 |
C25D1/04;C25D3/38;C25D5/50;C25D7/06;H05K1/03;H05K1/09 |
主分类号 |
C25D1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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