发明名称 SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR STRUCTURE BODIES ON UPPER AND LOWER SURFACES THEREOF, AND METHOD OF MANUFACTURING THE SAME
摘要 A semiconductor device includes an upper circuit board which has a plurality of upper-layer wirings including a plurality of first upper-layer wirings, and has a plurality of first and second lower-layer wirings. A first semiconductor structure body is provided on an upper side of the upper circuit board and is electrically connected to the first upper-layer wirings. A lower circuit board which is provided on a peripheral part of a lower side of the upper circuit board, the lower circuit board including a plurality of external connection wirings that are electrically connected to the first lower-layer wirings, and an opening portion which exposes the second lower-layer wirings. A second semiconductor structure body which is disposed in the opening portion of the lower circuit board, second semiconductor structure body including a plurality of external connection electrodes that are electrically connected to the second lower-layer wirings of the upper circuit board.
申请公布号 WO2008111546(A2) 申请公布日期 2008.09.18
申请号 WO2008JP54235 申请日期 2008.03.03
申请人 CASIO COMPUTER CO., LTD.;NEGISHI, YUJI 发明人 NEGISHI, YUJI
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