摘要 |
A semiconductor device includes an upper circuit board which has a plurality of upper-layer wirings including a plurality of first upper-layer wirings, and has a plurality of first and second lower-layer wirings. A first semiconductor structure body is provided on an upper side of the upper circuit board and is electrically connected to the first upper-layer wirings. A lower circuit board which is provided on a peripheral part of a lower side of the upper circuit board, the lower circuit board including a plurality of external connection wirings that are electrically connected to the first lower-layer wirings, and an opening portion which exposes the second lower-layer wirings. A second semiconductor structure body which is disposed in the opening portion of the lower circuit board, second semiconductor structure body including a plurality of external connection electrodes that are electrically connected to the second lower-layer wirings of the upper circuit board. |