Electronic module e.g. for motor vehicle controls, has part of bonding links formed by bonding wire provided with insulating layer

摘要

An electronic module (1) has bonding links (12) for electrical contact with at least one electronic component (5) mounted on a carrier body (4) and/or of a conduction path structure on the carrier body (4) and/or of connection contacts (11). At least one part of the bonding links (12) is formed by a bonding wire (17) provided with an insulating layer (19).