MICROFLUIDIC DEVICES FOR HEAT TRANSFER

摘要

In accordance with the present invention there is provided a microfluidic heat exchange system for cooling heat-generating components of electronic equipment, computers, lasers, analytical instruments, medical equipment and the like. Both direct contact and indirect contact microfluidic systems are described. Also described are microfluidic systems that incorporate remote heat rejection systems that may be located outside the body of the equipment that contains the heat generating components that need cooling.