| 摘要 |
PROBLEM TO BE SOLVED: To provide semiconductor sealing epoxy resin compositions excellent in storage stability and quick curability as well. SOLUTION: Semiconductor sealing epoxy resin compositions comprise, together with (A) an epoxy resin and (B) a phenolic resin, (C) a curing agent and (D) a curing accelerator-containing microcapsule having a core/shell structure in which the core portion is of a curing accelerator and the shell portion is of a thermoplastic resin. |
