发明名称 Over-voltage protection system for integrated circuits using the bonding pads and passivation layer
摘要 A protection system for integrated circuits which prevents inadvertent damage caused by over-voltage power surges by extending the passivation layer of an integrated circuit over the bonding pads and placing a ground plane over that passivation layer so as to create an over-voltage switching element out of that combination.
申请公布号 AU3077499(A) 申请公布日期 1999.09.27
申请号 AU19990030774 申请日期 1999.03.09
申请人 ORYX TECHNOLOGY CORPORATION 发明人 JAMES INTRATER;JOSHI KAILASH
分类号 H01L27/04;H01L21/822;H01L23/62 主分类号 H01L27/04
代理机构 代理人
主权项
地址