发明名称 |
Over-voltage protection system for integrated circuits using the bonding pads and passivation layer |
摘要 |
A protection system for integrated circuits which prevents inadvertent damage caused by over-voltage power surges by extending the passivation layer of an integrated circuit over the bonding pads and placing a ground plane over that passivation layer so as to create an over-voltage switching element out of that combination. |
申请公布号 |
AU3077499(A) |
申请公布日期 |
1999.09.27 |
申请号 |
AU19990030774 |
申请日期 |
1999.03.09 |
申请人 |
ORYX TECHNOLOGY CORPORATION |
发明人 |
JAMES INTRATER;JOSHI KAILASH |
分类号 |
H01L27/04;H01L21/822;H01L23/62 |
主分类号 |
H01L27/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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