| 摘要 |
<p>PURPOSE: To supply an IC card module at a low cost. CONSTITUTION: After a conductive adhesive is supplied on the leads 3 of a terminal substrate 4 and an insulating epoxy sealing resin 12 is supplied to the center of an IC mounting part, an IC chip 5 is mounted by positioning the leads 3 and the pad of the IC chip 5 and the resin being the same as the epoxy sealing resin 12 in the hardening processing condition of the conductive adhesive 11 is used so that process is constituted of a processing where the conductive adhesive 11 and the sealing resin 12 are hardened by fixed time heating in a low temp. furnace in a same state. The respective leads drawn from the respective terminal parts for connection with an external part and the connecting part of the IC chip 5 are arranged on a concentric circle. Thus, the IC card module with more strength can be provided at a low cost.</p> |
