发明名称 |
Laser-broken fuse |
摘要 |
In a laser-broken fuse used in a memory redundancy technique, an aluminum wiring layer is formed on an interlevel insulating film. A portion of the wiring layer is selected to be broken to shut off conduction of the layer. A polysilicon-made heat member is provided in the interlevel insulating film at the place which is underneath the selected portion. The heat member is located on a field insulating film. This heat member generates heat by absorbing energy from a laser beam, and thermal-explodes in a sealed atmosphere so as to break the selected portion.
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申请公布号 |
US5321300(A) |
申请公布日期 |
1994.06.14 |
申请号 |
US19920865681 |
申请日期 |
1992.04.08 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
USUDA, YOSHIO;ITABA, HIROAKI;KUMAGAI, JUMPEI;KAKI, SEIJI |
分类号 |
H01L21/82;H01L23/525;(IPC1-7):H01L27/02;H01L23/48 |
主分类号 |
H01L21/82 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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