发明名称 Laser-broken fuse
摘要 In a laser-broken fuse used in a memory redundancy technique, an aluminum wiring layer is formed on an interlevel insulating film. A portion of the wiring layer is selected to be broken to shut off conduction of the layer. A polysilicon-made heat member is provided in the interlevel insulating film at the place which is underneath the selected portion. The heat member is located on a field insulating film. This heat member generates heat by absorbing energy from a laser beam, and thermal-explodes in a sealed atmosphere so as to break the selected portion.
申请公布号 US5321300(A) 申请公布日期 1994.06.14
申请号 US19920865681 申请日期 1992.04.08
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 USUDA, YOSHIO;ITABA, HIROAKI;KUMAGAI, JUMPEI;KAKI, SEIJI
分类号 H01L21/82;H01L23/525;(IPC1-7):H01L27/02;H01L23/48 主分类号 H01L21/82
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