| 摘要 |
A method of dicing a semiconductor wafer for dividing a semiconductor wafer having a large number of devices formed thereon in a matrix into a large number of chips by the use of a diamond blade, includes the steps of first cutting by the use of the diamond blade in such a manner as to leave a partial residual portion or portions in a direction of thickness of the wafer and to define a plurality of grooves on the wafer in transverse and longitudinal directions, and then cutting the wafer along the grooves by the use of a resin blade having a width equal to or smaller than that of the diamond blade while a feed speed thereof is kept lower than that of the diamond blade.
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