| 摘要 |
PURPOSE:To make pattern dimensions uniform by a method wherein the prescribed pattern, to be transferred to a photosensitive organic material film through a mask, is composed of a plurality of masks, and the prescribed patterns are formed by conducting an exposure process and a developing treatment on each mask. CONSTITUTION:The first exposure is conducted on a silicon semiconductor substrate on which a positive type photoresist is spin-coated using the first exposure reticle 12a. Then, the second exposure is conducted on the silicon semiconductor substrate on which the first exposure is finished using the second exposure reticle 12b. The position of pattern is arranged by shifting downward the pattern of the first exposure reticle. The second hole pattern should be designed in such a manner that it is positioned in the middle of the hole pattern formed by the first exposure. After exposure, the photoresist on the exposed part of the semiconductor substrate is removed by an alkaline developing solution, and a pattern is formed on the prescribed position without receiving proximity effect. As a result, the problem of proximity effect can be removed, and the dimensional irregularity can be lessened. |
