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发明名称
BUMP FORMATION OF IC PACKAGE
摘要
申请公布号
JPH03255633(A)
申请公布日期
1991.11.14
申请号
JP19900053313
申请日期
1990.03.05
申请人
NGK SPARK PLUG CO LTD
发明人
MIYAWAKI NOBUHIKO;KANBE ROKURO
分类号
H01L21/60;H05K1/03;H05K3/00;H05K3/40
主分类号
H01L21/60
代理机构
代理人
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