发明名称 PARTIAL PLATING METHOD UTILIZING SEPARATOR AND ITS APPARATUS
摘要 PURPOSE:To form simply and easily a high-quality plated layer by providing a specified separator between a mask and a plating liquid spray nozzle when a minute part of a material is plated by using the mask with a plating liquid spray method. CONSTITUTION:The region to be plated of a work 11 as a material to be plated is covered with a mask 12A, and a plating liquid spray nozzle 14A and a nozzle holder 16 having a plating liquid discharge hole 15 are provided at the lower stage of a holder 13 of the mask 12A. In addition, a jacket box 19 having a chamber 17 which communicates with a gas-liquid separator 20 and a suction mechanism 21 through a circulation hole 18 is provided thereunder, the plural thin and flat plate-shaped mask bodies 24 of an electrically nonconductive material are provided in parallel in a dent 22 of the mask holder 13. A separator 31A made of an insulating material is further placed in between to separate the region to be plated into plural minute parts to be plated in the specified form. The plating liquid is sprayed on the region necessary to be plated by the mask 12A and the separator 31A, and a specified minute high-quality plated layer is formed at low cost.
申请公布号 JPS60234991(A) 申请公布日期 1985.11.21
申请号 JP19840090029 申请日期 1984.05.02
申请人 SONITSUKUSU:KK 发明人 SHIMAZU YASUO
分类号 C25D5/02 主分类号 C25D5/02
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