| 发明名称 | Ultrasonic sensor | ||
| 摘要 | An ultrasonic sensor includes a transceiver block having a transceiver device for transmitting and receiving ultrasonic waves and a circuit board mounted with an electronic circuit for processing ultrasonic signals transmitted and received through the transceiver device. A housing of the ultrasonic sensor has an opening and a communication hole, and the circuit board is stored into the housing through the opening. The transceiver block is attached to the housing. An electric connector extends through the communication hole of the housing to electrically interconnect the transceiver device and the electronic circuit of the circuit board; and a cover member closes the opening of the housing. The communication hole is sealed by a filler material. | ||
| 申请公布号 | US8897025(B2) | 申请公布日期 | 2014.11.25 |
| 申请号 | US201213426959 | 申请日期 | 2012.03.22 |
| 申请人 | Panasonic Corporation | 发明人 | Urase Hiroshi;Nagano Yasushi |
| 分类号 | H05K5/00;G01S7/521;G10K11/00 | 主分类号 | H05K5/00 |
| 代理机构 | Bacon & Thomas, PLLC | 代理人 | Bacon & Thomas, PLLC |
| 主权项 | 1. An ultrasonic sensor, comprising: a transceiver block having a transceiver device for transmitting and receiving ultrasonic waves; a circuit board mounted with an electronic circuit for processing ultrasonic signals transmitted and received through the transceiver device; a housing having an opening and a communication hole, the circuit board being stored into the housing through the opening, the transceiver block being attached to the housing; an electric connector extending through the communication hole of the housing to electrically interconnect the transceiver device and the electronic circuit of the circuit board; and a cover member closing the opening of the housing, wherein a filler material seals the communication hole without filling around the circuit board; and wherein the filler material sealing the communication hole is filled in the transceiver block. | ||
| 地址 | Osaka JP | ||