| 发明名称 |
METHOD AND DEVICE FOR DETACHING SOLDERED COMPONENT |
| 摘要 |
<p>The present invention is a method for detaching, from a substrate (30), an electronic component (32) that is soldered to the substrate (30). The method comprises a step of attaching a magnetic body (40) to the electronic component (32), a step of moving a magnet (20) attached to a component retaining rod (18) so that the magnetic force of the magnet (20) acts on the magnetic body (40), a step of heating a solder ball (38) between the electronic component (32) and the substrate (30) to melt the solder ball (38), and a step of moving the magnet (20) away from the substrate (30) to detach the electronic component (32) from the substrate (30).</p> |
| 申请公布号 |
WO2012127536(A1) |
申请公布日期 |
2012.09.27 |
| 申请号 |
WO2011JP01745 |
申请日期 |
2011.03.24 |
| 申请人 |
FUJITSU TELECOM NETWORKS LIMITED;ARIMURA, TAKUYA;HIRANO, MAKOTO |
发明人 |
ARIMURA, TAKUYA;HIRANO, MAKOTO |
| 分类号 |
H05K3/34;H01L21/60 |
主分类号 |
H05K3/34 |
| 代理机构 |
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| 主权项 |
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