A CARRIER MEMBER FOR MANUFACTURING A SUBSTRATE AND A METHOD OF MANUFACTURING A SUBSTRATE USING THE SAME

摘要

PURPOSE: A carrier member and a method for manufacturing a substrate using the same are provided to steadily perform the manufacturing process of the board by bonding a metal layer to sub bonding layer. CONSTITUTION: A bonding layer(120) is putted on the one side or the both sides of a Base substrate(110). A sub bonding layer(130) is formed in smaller size than the bonding layer and is buried in the one side of the bonding layer. A metal layer(140) is putted on the one side of the sub bonding layer. The girth of the metal layer is bonded to the bonding layer. The remaining parts except the girth of the metal layer are bonded to the sub bonding layer.