| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a non-contact IC tag preventing IC chip from being compressed to breakdown by arranging a strip-like structure on both sides of the IC chip. <P>SOLUTION: In the non-contact IC tag 1 having the IC chip breakdown prevention structure, an antenna pattern 2 is formed on a base film surface 11, the IC chip 3 is mounted, wherein the non-contact IC tag has a surface protective member. In the non-contact IC tag in which two sheets of strip-like structures 10a and 10b are arranged with an interval so as to form a parallel band-shaped groove on the both sides of the IC chip 3 between the surface protective member and the base film 11, the load of the IC chip at compression breakdown is 1,000 N or more, otherwise the load of a part other than the strip-like structures 10a and 10b is three times or more as large as a non-contact IC tag having the same structure. In addition, it is preferable that the thickness of the strip-like structures is not larger than the equivalent thickness of the IC chip 3. <P>COPYRIGHT: (C)2007,JPO&INPIT |
