发明名称 HEAT CONDUCTION SPACER
摘要 PROBLEM TO BE SOLVED: To provide a heat conduction spacer for conducting heat from a heatsink to a case. SOLUTION: A heat conduction spacer 10 is attached to a case 32 by a snap 25 and attached to a heatsink 31 by a snap 26. Since the case 32, the heatsink 31, and a heat conduction elastic material 16 are sandwiched by the snaps 25 and 26 and a heat conduction rigid material 12, the case 32, the heat conduction elastic material 16, the heat conduction rigid material 12, the heat conduction elastic material 16, and the heatsink 31 are in close contact with one another so that heat may be conducted efficiently from the heatsink 31 to the case 32, and may be dissipated from the case. Even if the thickness of the heat conduction elastic material 16 makes about 4 mm as a higher limit, the thickness of the heat conduction rigid material 12 is not restrained. Therefore, even in the case that the clearance between the heatsink 31 and the case 32 is large, it is possible to cope certainly with the problem. The attachment of the heat conduction spacer 10 is carried out by the snaps 25 and 26 so that workability may be good. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2006019403(A) 申请公布日期 2006.01.19
申请号 JP20040194126 申请日期 2004.06.30
申请人 KITAGAWA IND CO LTD 发明人 YANASE YOSHIAKI
分类号 H01L23/36;H05K7/20 主分类号 H01L23/36
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