| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a newly proposed capacitor mounting wiring board and manufacturing method thereof which can make contribution to improvement in operation reliability of semiconductor element or the like to be mounted by effective decoupling through reduction of ESL of the capacitor to be mounted. <P>SOLUTION: In the capacitor mounting wiring board 10e, a plurality of wiring layers 14a, 14b, 16a, 16b, 18a, 18b formed as the patterns of the predetermined shape are laminated via insulating layers 15a, 15b, 17a, and 17b and are mutually connected via a conductor formed through the insulating layers in the thickness direction. The capacitor 1 for decoupling is electrically connected with the relevant wiring layer adjacent to the wiring layers 14a, 18a provided as power supply line or ground line. Moreover, this capacitor 1 is mounted to invert the direction of current flowing into the relevant wiring layers 14a, 18a from that of the current when it is applied to the capacitor 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
