| 摘要 |
The present invention is related to a surface mounting type of LED (Light Emitting Diode), whose purpose is, by mounting LED chip of InGaN, GaN type which is the emitting source of LED, on the die pad cup of lead frame which is plated with silver of high reflexibility of light, that the particle of light totally reflected from the chip is emitted toward front, and then the light brightness in package lens surface can be improved. The LED chip of InGaN, GaN type is die bonded and wire bonded, then molded by light transmitting epoxy resin so that the light transmitting epoxy resin in lower part of package can produce a projection of 10-50um approximately comparing the lower part of lead frame in the same plate, and then the upper part and lower part is fixed through penetration hole. |
