| 摘要 |
<p>PURPOSE: To mount a semiconductor element without efforts to reduce the thickness and to make a strong and mechanical connection between the semiconductor element and a printed wiring board by electrically connecting the connection lead of the semiconductor element to an electrode and holding part of the semiconductor element on the flank of an insulating substrate by adhesion. CONSTITUTION: On both the surfaces of the insulating substrate 11 formed of a polyimide film, a coiled wire 17 and the electrode 14 which are connected through holes 12 and 13 are formed. The outward shape machining of the circumference of the electrode 14 is performed to cut the through holes formed at a drill machined part through a plating process, thereby forming the electrode 14 on the flank of the insulating base material 11. Further, the semiconductor element 22 is fixed to the flank of the electrode 14 by using solder 24 and the flank of the element 22 is fixed to the flank of the base material 11 by using an adhesive 25. Consequently, the semiconductor element can be mounted with no increase in the thickness of the module without the efforts to reduce the thickness while affecting the quality item that the noncontact needs.</p> |
