| 摘要 |
In a semiconductor optocoupler device, a surface mount package single plane lead frame (10) includes LED flags (12,32) and phototransistor detector flags (20,30) for mounting photocoupler emitter-detector die pairs. Emitter (23,47) and anode (17,37) flags provide wire bond sites, for the dies, emitter flags being coupled to emitter leads (22,44) and detector flags being coupled to collector leads (18,38). The other ends of the leads are coupled in common to a die bar (11). LED flags are coupled to cathode leads (14,34) and anode flags are coupled to anode leads (16,36), these leads being coupled to a dam bar (21). Dam bars are coupled to side rails (66,68). Angles of centrelines (28,42) between LED flags and detector flags w.r.t. longitudinal axis (24) of the lead frame is determined from an arc sine of a ratio of a critical path length of the lead frame to a width of the lead frame and is less than 90[deg]. |
