| 摘要 |
PROBLEM TO BE SOLVED: To thin a surface mount EL driver. SOLUTION: The surface mount EL driver comprises upper and lower surface connecting patterns 1a, 1b formed on a circuit board 1 for constituting the EL driver 8 to communicate with a through hole electrode 3, an electronic components such as a coil 4, an IC chip 5, a chip capacitor 6 and the like mounted on the upper surface of the board 1. The components are sealed with a resin 7 formed in a protruding resin shape so that the upper surface connecting pattern 1a is exposed. A relief hole 9a is formed in a mounting board 9, and the resin 7 is housed in the hole 9a. The wiring pattern formed on the pattern 1a is electrically connected to the wiring pattern formed on the board 9 via solder 10 filled in the through hole electrode 3. Thus, the height after mounting can be suppressed.
|
