发明名称 RUBBER CHIP AND ELASTIC PAVING MATERIAL FOR ELASTIC PAVEMENT
摘要 <p>PROBLEM TO BE SOLVED: To provide an elastic paving material capable of suppressing the increase of a surface temperature thereof even in a hot season such as summer.SOLUTION: An elastic pavement material 20 is manufactured by binding rubber chips 10 for elastic pavement formed by foam rubber containing heat shielding pigment. Foamed holes 11 for the rubber chips 10 for elastic pavement are isolated cells. The diameter of the foamed hole 11 (isolated cell) is preferably 20-200μm. The expansion ratio of the rubber chips 10 for elastic pavement is preferably 1.1-3 times. Thus, the elastic pavement material 20 can be made to have a small bulk density and be less apt to increase surface temperature thereof even in a hot season such as summer.</p>
申请公布号 JP2015055098(A) 申请公布日期 2015.03.23
申请号 JP20130188912 申请日期 2013.09.12
申请人 NISSHIN RUBBER KK;IK:KK 发明人 WAKI AKIHIKO;ISOGAWA TOKIKICHI
分类号 E01C5/18;E01C7/30 主分类号 E01C5/18
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